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portada Advances in Nanoengineering: Electronics, Materials and Assembly
Type
Physical Book
Language
English
Pages
328
Format
Hardcover
Dimensions
23.0 x 16.3 x 2.1 cm
Weight
0.63 kg.
ISBN
1860947514
ISBN13
9781860947513

Advances in Nanoengineering: Electronics, Materials and Assembly

J. Michael T. Thompson (Author) · Giles Davies (Author) · Imperial College Press · Hardcover

Advances in Nanoengineering: Electronics, Materials and Assembly - Thompson, J. Michael T. ; Davies, Giles

New Book Imported to South Africa
Delivery: 04 Aug - 12 Aug Shipping: 5 to 6 business days.
R 4,465
R 4,465

Synopsis "Advances in Nanoengineering: Electronics, Materials and Assembly"

This book outlines a selection of exciting advances currently being made worldwide in the field of modern engineering at the nanometer scale. Leading scientists and engineers give a general overview of research advances in their specialized subject areas. They also describe some of their own cutting-edge research and give their visions of the future.Written in a popular and well-illustrated style, the articles are written by young scientists many of whom hold, or have held, prestigious Royal Society or EPSRC Fellowships. Carefully selected by Professor A G Davies and Professor J M T Thompson FRS, topics include: the fabrication and measurement of nanoelectronic devices, organic conductors, and bioelectronic materials; the assembly of such structures into appropriate configurations, including the use of biological processes to drive the assembly; the development of new materials including both organic and inorganic wires, carbon nanotubes, and magnetic materials; and finally, the analysis and characterization of these structures.The book conveys the excitement and enthusiasm of the authors for their work at the frontiers of modern engineering nanotechnology. All are definitive reviews for readers with a general interest in the future directions of science and engineering at the nanometer scale.

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All books in our catalog are Original.
The book is written in English.
The binding of this edition is Hardcover.

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