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portada Computational Intelligence and Industrial Applications. 11th International Symposium, ISCIIA 2024, Beijing, China, November 1–5, 2024, Proceedings, Part II
Type
Physical Book
Collection
Communications in Computer and Information Science
Year
2025
Pages
337
Format
Paperback
Dimensions
23.50 x 15.50 cm
ISBN13
9789819647552

Computational Intelligence and Industrial Applications. 11th International Symposium, ISCIIA 2024, Beijing, China, November 1–5, 2024, Proceedings, Part II

Bin Xin;Weihua Cao;Jinhua She;Hongbin Ma (Author) · Springer Nature Switzerland AG · Paperback

Computational Intelligence and Industrial Applications. 11th International Symposium, ISCIIA 2024, Beijing, China, November 1–5, 2024, Proceedings, Part II - Bin Xin;Weihua Cao;Jinhua She;Hongbin Ma

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Synopsis "Computational Intelligence and Industrial Applications. 11th International Symposium, ISCIIA 2024, Beijing, China, November 1–5, 2024, Proceedings, Part II"

mso-ansi-language: EN-US; mso-ansi-language: EN-US; mso-fareast-language: EN-US; mso-ansi-language: EN-US; mso-ansi-language: EN-US; mso-fareast-language: EN-US; mso-ansi-language: EN-US; mso-ansi-language: EN-US; mso-fareast-language: EN-US; mso-ansi-language: EN-US; mso-ansi-language: EN-US; mso-fareast-language: EN-US; mso-ansi-language: EN-US;

This two-volume set CCIS 2465-2466, constitutes of the proceedings of 11th International Symposium on Computational Intelligence and Industrial Applications, ISCIIA 2024, held in Beijing, China, during November 1–5, 2024.

The 55 full papers and 5 short papers included in this volume were carefully reviewed and selected from 135 submissions. The topics cover the following fields connected to computational intelligence and intelligent informatics: intelligent information processing, pattern recognition and computer vision, intelligent optimization and decision-making, advanced control, multi-agent systems, robotics and various applications of computational intelligence methods such as neural networks, fuzzy reasoning, evolutionary computing, machine learning and deep learning.

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