Tracked shipping to South Africa with premium packaging for just R199 

Ship to
South Africa
0

My Account

  • argentina
  • chile
  • colombia
  • españa
  • méxico
  • perú
  • estados unidos
  • internacional

menu

Select your country

Americas

Europe

Rest of the world

portada Cooling of Discrete Heat Sources under Natural and Mixed Convection
Type
Physical Book
Author
Publisher
Language
English
Pages
184
Format
Paperback
Dimensions
22.9x15.2x1.1 cm
Weight
0.28 kg.
ISBN13
9786200093554
Categories

Cooling of Discrete Heat Sources under Natural and Mixed Convection

Tapano Kumar Hotta (Author) · S. P. Venkateshan (Author) · C. Balaji (Author) · LAP Lambert Academic Publishing · Paperback

Cooling of Discrete Heat Sources under Natural and Mixed Convection - Hotta, Tapano Kumar ; Venkateshan, S. P. ; Balaji, C.

New Book Imported to South Africa
Delivery: 30 Sep - 08 Oct Shipping: 13 to 14 business days.
R 1,377
R 1,377

Choose the list to add your product or create one New List

Go to My Wishlists
Calculate shipping cost

Synopsis "Cooling of Discrete Heat Sources under Natural and Mixed Convection"

Due to rapid advancement in integrated circuit technology, and increasing power dissipation, thermal management of electronics has become increasingly challenging. For reliable operation of electronic components, their operating temperature must not exceed about 85 C. As the size of electronic components becomes smaller and smaller, the area available for heat dissipation also becomes smaller. This results in a dissipation of high heat flux at the chip level, thereby necessitating the development of more efficient thermal management solutions. In view of the above, it is imperative to seek the optimal distribution of heat sources mounted on a PCB, to improve the cooling rate, and thereby their reliability, and life. Discrete heat sources are individual heating elements mounted on the motherboard of computers. Often times, the PCB (FR4) is mimicked by a low thermal conductivity material, Bakelite, and the discrete heat sources or IC chips, usually made of Silicon by Aluminum. The main objective of this present study is to seek the optimal configuration of discrete heat sources mounted on the PCB board losing heat by convection and radiation.

Customers reviews

More customer reviews
  • 0% (0)
  • 0% (0)
  • 0% (0)
  • 0% (0)
  • 0% (0)

Frequently Asked Questions about the Book

Is the book original?

All books in our catalog are Original.

In what language is the book written?

The book is written in English.

What is the format of this book?

The binding of this edition is Paperback.

Questions and Answers about the Book

Do you have a question about the book? Login to be able to add your own question.

Opinions about Bookdelivery

More customer reviews