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portada Electronic Packaging Materials and Their Properties
Type
Physical Book
Publisher
Language
English
Pages
120
Format
Hardcover
ISBN13
9780849396250
Edition No.
1

Electronic Packaging Materials and Their Properties

Pecht Michael Agarwal Rakish Mccluskey F. Patrick Dish (Author) · Crc Press · Hardcover

Electronic Packaging Materials and Their Properties - Pecht Michael Agarwal Rakish Mccluskey F. Patrick Dish

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Synopsis "Electronic Packaging Materials and Their Properties"

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnectionsprinted circuit boardssubstratesencapsulantsdielectricsdie attach materialselectrical contactsthermal materialssoldersElectronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

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All books in our catalog are Original.
The book is written in English.
The binding of this edition is Hardcover.

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