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portada New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation
Type
Physical Book
Publisher
Language
English
Pages
72
Format
Paperback
Dimensions
23.5 x 19.1 x 0.4 cm
Weight
0.16 kg.
ISBN13
9783031008993
Edition No.
1

New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation

Nabil Shovon Ashraf (Author) · Shawon Alam (Author) · Mohaiminul Alam (Author) · Springer · Paperback

New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation - Ashraf, Nabil Shovon ; Alam, Shawon ; Alam, Mohaiminul

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Synopsis "New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation"

In order to sustain Moore's Law-based device scaling, principal attention has focused on toward device architectural innovations for improved device performance as per ITRS projections for technology nodes up to 10 nm. Efficient integration of lower substrate temperatures (

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The book is written in English.
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