Name: Packaging and Embedded Electronics for the Next Generation
Price: 448.00 ZAR
Availability: InStock
Author: Nasa Technical Reports Server (Ntrs) ; Sampson, Michael J.
ISBN: 9781289250560

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portada Packaging and Embedded Electronics for the Next Generation

Packaging and Embedded Electronics for the Next Generation

Type

Physical Book

Author

Nasa Technical Reports Server (Ntrs)

Michael J. Sampson

Publisher

Bibliogov

Language

English

Pages

Format

Paperback

Dimensions

24.6 x 18.9 x 0.1 cm

Weight

0.06 kg.

ISBN13

9781289250560

Synopsis "Packaging and Embedded Electronics for the Next Generation"

This viewgraph presentation describes examples of electronic packaging that protects an electronic element from handling, contamination, shock, vibration and light penetration. The use of Hermetic and non-hermetic packaging is also discussed. The topics include: 1) What is Electronic Packaging? 2) Why Package Electronic Parts? 3) Evolution of Packaging; 4) General Packaging Discussion; 5) Advanced non-hermetic packages; 6) Discussion of Hermeticity; 7) The Class Y Concept and Possible Extensions; 8) Embedded Technologies; and 9) NEPP Activities.

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Packaging and Embedded Electronics for the Next Generation - Nasa Technical Reports Server (Ntrs) ; Sampson, Michael J.

Synopsis "Packaging and Embedded Electronics for the Next Generation"

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