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portada wafer bonding: applications and technology
Type
Physical Book
Illustrated by
Publisher
Author
Year
2013
Language
English
Pages
504
Format
Paperback
Dimensions
23.4x15.6x2.7 cm
Weight
0.73 kg.
ISBN
3642059155
ISBN13
9783642059155
Categories

wafer bonding: applications and technology

Marin Alexe (Illustrated by) · Ulrich Gösele (Illustrated by) · Springer · Paperback

wafer bonding: applications and technology - Alexe, Marin ; Gösele, Ulrich

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Synopsis "wafer bonding: applications and technology"

The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

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